| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide: a metal foil with a carrier foil, eliminating an etching process for removing scattered copper and a roughened layer while maintaining direct laser workability; a metal foil with a resin; and a metal foil clad laminate.SOLUTION: There are provided: (1) a metal foil with a carrier foil, including a metal foil and a carrier foil that can be physically separated from the metal foil, and having a total thickness of the metal foil and the carrier foil of 12μm or less; (2) a metal foil with a carrier foil that has a tensile strength of 600 MPa or more, in the metal foil with a carrier foil as mentioned in (1); (3) a metal foil with a carrier foil that has a thickness of 6-11μm, in the metal foil with a carrier foil as mentioned in (2); (4) a metal foil with a resin including an adhesive resin disposed on a surface of a metal foil of one of the metal foils with a carrier foil as mentioned in (1)-(3), the surface being on a side opposite to a carrier foil; and (5) a metal foil clad laminate including an insulating resin and a conductor which are disposed on a side of a metal foil of one of the metal foils with a carrier foil as mentioned in (1)-(4), the side being opposite to a carrier foil.</p> |
