发明名称 Curable composition
摘要 The present invention provides a curable composition comprising: (a) a resin composition being liquid at 23° C. and comprising monomers or oligomers or a mixture of monomers and oligomers polymerizable by a ring-opening reaction; (b) an impact modifier containing one or more block copolymers having at least one block composed of methyl methacrylate and (c) one or more polymerization initiators. The curable resin composition can be used for curable coatings per se and in specific for stereolithography and other applications such as three dimensional printing applications where a 3D object is formed.
申请公布号 KR101507184(B1) 申请公布日期 2015.03.30
申请号 KR20097018919 申请日期 2008.03.12
申请人 发明人
分类号 C08G65/02;C08J3/28;C08L33/12;C08L63/00 主分类号 C08G65/02
代理机构 代理人
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