| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting device which can successfully mount an electronic component on a substrate in a simple composition.SOLUTION: A mounting device comprises: a pressure bonding tool 4 for mounting by applying pressure and heat to an electronic component P on a top face of a side part of a substrate W supported by a backup tool 3 from an undersurface; a supply reel 16 around which a sheet 11 supplied to between the top face of the side part of the substrate and the pressure bonding tool is wound; sandwiching means which has a drive roller 24 and a sandwiching roller 31 with an outer peripheral surface being provided in flexible contact with the drive roller, for sandwiching the sheet; a rotary drive source for feeding the sandwiched sheet by rotationally driving the drive roller; and a linear drive source 18 which causes the sandwiching means to loosen the sheet and position the sandwiching means on the side opposite to the supply reel across the pressure bonding tool so that the sheet contacts the electronic component when the electronic component is mounted on the substrate, and positions the sandwiching means closer to the supply reel side than the pressure bonding tool when the supply reel is replaced with a new supply reel.</p> |
