CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT

摘要

A pad conditioner for a CMP polishing pad. The pad conditioner includes a features having textured or roughened surfaces, with superabrasive grit seeds such as diamond interspersed on the roughened surface. A coating such as polycrystalline diamond can be applied over the surfaces and the grit seeds. In one embodiment, the coating has a thickness that is in the range of 50% to 100% of the larger superabrasive grit.

主权项

1. A chemical mechanical polishing pad conditioner, comprising:
a substrate including a front surface having a plurality of protrusions integral therewith, said plurality of protrusions extending in a frontal direction that is substantially normal to said front surface, each of said plurality of protrusions including a distal extremity, each of said plurality of protrusions having a root-mean-square surface roughness that is greater than 3 μm; a dispersion of superabrasive grit seeds disposed on said substrate, the dispersion on the protrusions and intermediate the protrusions; and a diamond coating that covers said substrate, said protrusions and said dispersion of superabrasive grit seeds.