DEPOSITION OF CU, SN, ZN-LAYERS ON METALLIC SUBSTRATES

摘要

The invention relates to a novel electrolyte bath having a Cu and Sn content, and a zinc content which is a maximum of 5 g/l, preferably a maximum 3 g/l, for the deposition of a white layer on metallic substrates, in particular jewelery blanks and electronic components, the zinc content, said white layer having a maximum zinc content of10% in weight. Said covered objects and articles can be obtained by using said bath. The invention also relates to a method for producing the mentioned objects and articles and to the use of the novel electrolyte bath.