SEMICONDUCTOR DEVICE HAVING BONDING PAD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a bonding pad and a manufacturing method of the same.SOLUTION: A semiconductor device comprises: a device substrate having a surface side and a rear face side; a shallow trench isolation layer arranged on the surface side of the device substrate; an anti-reflection coating layer arranged on the rear face side of the device substrate; a first buffer layer which is arranged on the anti-reflection coating layer on the rear face side of the device substrate and physically contacts a part of the shallow trench isolation layer; a shield structure which is arranged on the first buffer layer on the rear face side of the device substrate and physically contacts the first buffer layer; an interconnection structure which is arranged on the device substrate on the surface side and has n-layer metal layers; and a bonding pad which passes the shallow trench isolation layer and the interconnecting structure and extends to directly contact the n-th metal layer of the n-layer metal layers.