| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive heat dissipation film which can exhibit excellent heat radiation performance when disposed in a small-sized electronic apparatus.SOLUTION: There is provided a heat dissipation film which comprises; a heat transmission layer obtained by firing a mixture layer comprising flaky carbon and a binder resin to carbonize or eliminate a binder resin; and a plastic film for covering the heat transmission layer, wherein the heat transmission layer having a density of 1.9 g/cmor more and a thermal conductivity of 450 W/mK or more is produced by (1) forming a laminate film by sandwiching a mixed layer of flaky carbon and a binder resin between a pair of first plastic films, (2) densifying the mixture layer by thermally pressing the laminate film, (3) carbonizing the binder resin in the mixture layer by firing the mixture layer, (4) forming a heat transmission layer by pressing the resulting fired layer and (5) sealing the heat transmission layer with a second plastic film. |
