METHOD FOR MANUFACTURING BOARD WITH METAL COATING, BOARD WITH METAL COATING AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To reduce cost and an environmental load by reducing the number of steps required for forming a plating pattern on a circuit board.SOLUTION: A binder material for a board 2 and an electroless plating catalyst is imparted onto the board 2 surface. A part 5 not to be plated on the board 2 surface is heated selectively. An electroless plating catalyst is imparted onto the board 2 surface after heat treatment. The board 2 to which the electroless plating catalyst is imparted is immersed into an electroless plating solution.