发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 It is made possible to provide a method for manufacturing a semiconductor device that has a high-quality insulating film in which defects are not easily formed, and experiences less leakage current. A method for manufacturing a semiconductor device, includes: forming an amorphous silicon layer on an insulating layer; introducing oxygen into the amorphous silicon layer; and forming a silicon oxynitride layer by nitriding the amorphous silicon layer having oxygen introduced thereinto.
申请公布号 US2015084113(A1) 申请公布日期 2015.03.26
申请号 US201414483280 申请日期 2014.09.11
申请人 Kabushiki Kaisha Toshiba 发明人 Matsushita Daisuke;Mitani Yuuichiro
分类号 H01L29/51;H01L27/115;H01L29/788 主分类号 H01L29/51
代理机构 代理人
主权项
地址 Tokyo JP