| 摘要 |
This semiconductor device is provided with: a first substrate having a first circuit formed thereupon; a second substrate having a second circuit formed thereupon, and spaced apart from the first substrate; connection parts that are positioned between the first substrate and the second substrate, and electrically connect the first circuit and the second circuit; and a shielding layer that is sandwiched, together with the connection parts, between the first substrate and the second substrate, is positioned so as to surround the connection parts, and is connected to a potential, the value of which is constant in the first substrate and/or the second substrate. |
