| 摘要 |
The present invention relates to a technique for preventing transformation of surface of an LED PCD and finally improving reflection ratio of a light radiated from an LED by improving heat resistance for high temperature generated during use in a state of being installed on a LED lighting device or high temperature environment of soldering process of LED PCB by improving the composition and composition ratio of ink coated on the surface of LED PCB installed on the LED lighting device, which is a technique for improving heat resistance of LED PCB and finally increasing reflection rate of light by containing 25-40 parts by weight of titanium oxide based on 100 parts by weight of total composition formed by containing epoxy acrylate, acryl monomer, talc, titanium oxide, and light controlling agent. According to the present invention, an advantage of not causing troubles of increasing manufacturing costs and increasing failure rate in a reflection sheet laminating process by application of an existing reflection sheet by not additionally applying constitution of attachment type reflection sheet for improving an existing reflection ration by improvement of durability for transformation of LED PCB. |
