| 摘要 |
The present invention relates to a printed circuit board and a manufacturing method thereof. According to an embodiment of the present invention, provided is a printed circuit board comprising: a base substrate; an inner build-up layer formed on the base substrate, and including a first inner circuit layer, a second inner circuit layer, an inner insulating layer, and an inner via having a cross section in a taper shape; and an outer build-up layer formed on the inner build-up layer, and including an outer circuit layer, and an outer insulating layer, and an outer via having a rectangular cross section. |
