发明名称 |
LED package structures for preventing lateral light leakage and method of manufacturing the same |
摘要 |
An LED package structure (Z) for preventing lateral light leakage includes a substrate unit (1), a light-emitting unit (2), a light-transmitting unit (3) and a light-shielding unit (4). The substrate unit (1) includes a circuit substrate (10). The light-emitting unit (2) includes at least one LED chip (20) disposed on the circuit substrate (10) and electrically connected to the circuit substrate (10). The light-transmitting unit (3) includes a light-transmitting gel body (30) disposed on the circuit substrate (10) for enclosing the LED chip (20). The light-transmitting gel body (30) has a first light-transmitting portion (30A) disposed on the circuit substrate (10) for enclosing the LED chip (20) and at least one second light-transmitting portion (30B) projected upwardly from the first light-transmitting portion (30A) and corresponding to the LED chip (20), and the second light-transmitting portion (30B) has a light output surface (300B). The light-shielding unit includes a light-shielding gel body (40) disposed on the circuit substrate (10) for exposing the light output surface (300B) of the second light-transmitting portion (30B). |
申请公布号 |
EP2851971(A1) |
申请公布日期 |
2015.03.25 |
申请号 |
EP20140185689 |
申请日期 |
2014.09.22 |
申请人 |
BRIGHTEK OPTOELECTRONIC (SHENZHEN) CO., LTD.;BRIGHTEK OPTOELECTRONIC CO., LTD. |
发明人 |
HUANG, CHIEN-CHUNG;WU, CHIH-MING;HUANG, TUNG PO |
分类号 |
H01L33/56;H01L25/075;H01L33/00;H01L33/54;H01L33/58 |
主分类号 |
H01L33/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|