| 摘要 |
<p>Provided in the present invention is an apparatus for treating a substrate. The substrate treating apparatus includes: a cup; a supporting unit located inside the cup and supporting a substrate; and a nozzle unit providing a treatment solution to the substrate put on the supporting unit, wherein the supporting unit comprises a supporting plate supporting the substrate, and a ring-shaped supporting protrusion protruded upward from the upper surface of the supporting plate, including a center groove inside, and supporting the edge region of the substrate.</p> |
