LED chip packaging structure, its manufacturing method, and display device

摘要

A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.

主权项

1. A LED chip packaging structure, comprising a LED chip unit and a conductive unit, wherein
the LED chip unit is formed with a first electrode, a GaN layer and a second electrode, the GaN layer is formed between the first electrode and the second electrode, and the first electrode is formed on the GaN layer, the conductive unit comprises: a first conductive layer formed at two opposite sides of the first electrode and electrically connected to the first electrode; a second conductive layer formed at two opposite sides of the second electrode and electrically connected to the second electrode; and an intermediate isolation layer formed at two opposite sides of the GaN layer and located between the first conductive layer and the second conductive layer; wherein the LED chip packaging structure is disposed in a supporting frame, the supporting frame comprises: a first conductive channel connected to the first conductive layer and a second conductive channel connected to the second conductive layer.