Underfill process and materials for singulated heat spreader stiffener for thin core panel processing

摘要

A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

主权项

1. An apparatus comprising: an IHS (integrated heat spreader) panel including a plurality of IHS components each containing a site to receive and bond with an IC (integrated circuit) die, wherein the IHS panel includes perimeter ribs that protrude perpendicularly from the plurality of IHS components, wherein the IHS panel includes a porous plug, and wherein the IHS panel includes an opening extending through a thickness of the IHS panel, wherein the IHS panel further comprises one or more gates which protrude from the perimeter ribs near IC die sites wherein the one or more gates are configured to channel flow of an underfill material beneath the IC die and around solder connections.