Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product

摘要

A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or more of the plurality of dummy components on the interposer die to form a unique identifier for the interposer die. An apparatus for a stacked silicon interconnect technology (SSIT) product includes an interposer die, and a plurality of dummy components at the interposer die. One or more of the plurality of dummy components is modifiable to form a unique identifier for the interposer die.

主权项

1. A method for tracking a plurality of interposer die of instances of a stacked silicon interconnect technology (SSIT) product, comprising:
forming a respective plurality of electrically conductive dummy components on each of the plurality of interposer die; and modifying one or more dummy components of each respective plurality of dummy components on the interposer die to form a unique identifier for each interposer die; wherein before and after the modifying, the dummy components are not electrically connected between integrated circuit dies and the interposer die of each instance of the SSIT product; and wherein the modified one or more dummy components of each respective plurality of dummy components are unique among the modified one or more dummy components.