Built-in electronic component substrate and method for manufacturing the substrate

摘要

A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.

主权项

1. A built-in electronic component substrate comprising:
a first substrate; an electronic component including side surfaces and mounted on the first substrate; a first resin provided on the first substrate and covering the side surfaces of the electronic component; a second substrate provided above the electronic component and the first resin and layered on the first substrate; a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates; a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate; and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin, wherein the second substrate and the second resin are in direct physical contact with each other, and the electronic component and the second resin are in direct physical contact with each other.