发明名称 Wafer substrate bonding structure and light emitting device comprising the same
摘要 A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive corpuscles included in the resin.
申请公布号 US8987920(B2) 申请公布日期 2015.03.24
申请号 US201113311856 申请日期 2011.12.06
申请人 LG Innotek Co., Ltd. 发明人 Cho Bum Chul
分类号 H01L23/48;H01L33/00;H01L33/60;H01L33/62;H01L33/64;H01L33/38 主分类号 H01L23/48
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A light emitting device comprising: a substrate; a conductive thin film disposed on the substrate; a reflective layer disposed on the conductive thin film; a first electrode layer disposed on the conductive thin film; a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer disposed on the reflective layer; and an insulation layer disposed between the reflective layer and the second semiconductor layer of the light emitting structure; wherein the conductive thin film includes a resin and conductive corpuscles, wherein the reflective layer is electrically insulated from the light emitting structure by the insulation layer, and wherein the conductive thin film includes a first area on which the reflective layer is disposed and a second area that electrically connects to the first electrode layer, wherein the first electrode layer includes a first electrode portion that is disposed between the reflective layer and the light emitting structure, and a second electrode portion that is disposed on a circumference area of the conductive thin film, and the insulation layer is a continuous insulation layer from the second electrode portion to the first electrode portion, the continuous insulation layer including: a first insulation portion between the first electrode portion and the reflective layer, wherein the first electrode portion is between the second semiconductor layer and the first insulation portion, anda second insulation portion between the second semiconductor layer and the reflective layer.
地址 Seoul KR