Polishing apparatus and polishing method

摘要

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

主权项

1. A polishing apparatus for polishing a notch portion of a substrate, said polishing apparatus comprising:
a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate; plural polishing head modules each configured to polish the substrate using a polishing tape; and a moving mechanism including a single X-axis moving mechanism and plural Y-axis moving mechanisms configured to move said plural polishing head modules along a X axis and a Y axis which are perpendicular to each other, said X-axis moving mechanism being configured to move said plural polishing head modules synchronously along the X axis, and said plural Y-axis moving mechanisms being configured to move said plural polishing head modules independently of each other along the Y axis, wherein each of said plural polishing head modules includes a polishing head configured to bring the polishing tape into sliding contact with the notch portion of the substrate, and a tape supplying and recovering mechanism configured to supply the polishing tape to said polishing head and recover the polishing tape from said polishing head.