Method for wafer separation

摘要

A plurality of macro and micro alignment marks may be formed on a wafer. The macro alignment marks may be formed in pairs at opposite edges of the wafer. The micro alignment marks may be formed to align to streets on the wafer along a first and second direction. A molding compound may be formed on the wafer. The macro alignment marks may be exposed from the molding compound. A pair of the micro alignment marks may be exposed from the molding compound at opposite ends of the streets along the first and the second direction. The wafer may be aligned to a dicing tool using pairs of the macro alignment marks. The dicing tool may be aligned to the streets using pairs of the micro alignment marks. The wafer may be diced using successive pairs of micro alignment marks along the first and second direction.

主权项

1. A method of dicing a wafer, comprising:
forming a molding compound over the wafer, wherein one or more electrical connectors are exposed through the molding compound; aligning a dicing tool to a first pair of first alignment marks along a first direction of the wafer, the first alignment marks having a first shape; aligning the dicing tool to a second pair of second alignment marks along the first direction of the wafer, the second alignment marks having a second shape; and dicing the wafer with the dicing tool along the first direction using the alignment of the second pair of second alignment marks.