Lamination of polymer thick film conductor compositions

摘要

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.

主权项

1. An electrical device comprising an electrical conductor formed from a polymer thick film solder alloy conductor composition, said polymer thick film solder alloy conductor composition comprising:
(a) 65 to 95 wt % SAC solder alloy powder consisting of tin, silver, and copper, wherein said tin is greater than 90 wt % of said SAC solder alloy powder, and said SAC solder alloy powder possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.2 to 1.3 m2/g; dispersed in (b) 5 to 35 wt % organic medium comprising:
(i) a vinyl co-polymer resin of vinylidene chloride and acrylonitrile, dissolved in(2) organic solvent comprising a dibasic ester; wherein the wt % of said SAC solder alloy powder and said organic medium are based on die total weight of the polymer thick film solder alloy conductor composition and wherein said electrical conductor has been subjected to lamination.