| 摘要 |
Provided is a COF package capable of preventing a short circuit between adjacent signal lines. The COF package includes a base film, an IC chip, and signal lines. The base film includes a bonding region and a non-bonding region. The IC chip is formed on the non-bonding region. The signal lines are respectively connected to the IC, are extended to be overlapped with the bonding region in a first direction, and are separated for each other. One end of the base film in the first direction, the signal lines are arranged one by one in at least one of the first side and the second side of the base film which face each other in a second direction intersecting with the first direction. |
