SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has good adhesion between a semiconductor substrate and a metal film and small electrical contact resistance; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises the steps of: forming a device structure on a surface of a semiconductor substrate 11; attaching the surface to a support substrate and grinding a rear face of the semiconductor substrate to thin the semiconductor substrate; forming grooves 12b on the rear face of the semiconductor substrate in a meshed pattern by performing etching on the rear face of the semiconductor substrate by using a resist pattern as a mask; and removing the resist pattern and subsequently depositing metal on the rear face of the semiconductor substrate by sputtering.