| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable thermoelectric module reduced in thermal stress generation and stable in structure.SOLUTION: A thermoelectric module comprises: a high temperature side base plate and a low temperature side base plate disposed opposite each other; a plurality of semiconductor elements stretched between the high and low temperature side base plates; and a plurality of wires arranged on the opposite faces of the high and low temperature side base plates, and having a plurality of wires for electrically connecting the semiconductor elements in series. All the semiconductor elements are electrically connected to wires arranged in layers on the high temperature side base plate via a liquid metal, and are electrically connected to wires arranged in layers on the low temperature side base plate via a solid metal. It is preferable that the high temperature side base plate and low temperature side base plate be connected. It is preferable that at least part of the semiconductor element side of the wires arranged in layers on the high temperature side base plate have a recessed part that is able to hold the liquid metal.</p> |
