| 摘要 |
<p>The present invention relates to a semiconductor package and, more specifically, to a semiconductor package having a new structure where formed is a dimple around the solder joint of the lead of a lead frame, and formed is a burr blocking means preventing burr from being introduced in the case of sawing the inner side of the dimple. Hence, provided are a semiconductor package preventing the burr generated in the case of sawing by a blade from being introduced into the inner dimple, by plating or applying conductive solder paste to the inside of the dimple of the lead, or forming a burr blocking wall, and a method for manufacturing the same.</p> |
