<p>The present invention relates to a composite functional sheet of a single body which is bonded on a printed circuit board by improving functions while thinning a thickness by a hardening process with heat and pressure in which constant temperature and pressure are provided and satisfies a soldering temperature in soldering. The composite functional sheet comprises: a B-stage available functional sheet of a thermosetting heat resistant epoxy resin in which 70 wt% or more of thermal conductive ceramic powders or soft magnetic powders for preventing electromagnetic wave absorption or static electricity are mixed; and a B-stage available adhesive sheet of the thermosetting heat resistance epoxy resin which is bonded by being laminated on at least one side of the functional sheet. The functional sheet and the adhesive sheet are solid phase conditions and forms a single body by being completely bonded to each other by being thermally hardened while being thinned in a thickness of 30% or more by predetermined temperature and pressure from the outside. The other side of the functional sheet is smooth. The adhesive sheet of the single body is thermally bonded to an object by thermal hardening. The single body satisfies the temperature conditions of soldering. The functional sheet improves functions by thinning the thickness.</p>
