| 摘要 |
<p>The present invention relates to a wafer carrier and a manufacturing method thereof and, more specifically, to a wafer carrier which is provided to make only a guide pin be replaced in case of the occurrence of chipping by having the guide pin combined with an edge where chipping frequently occurs, thereby having a practically-extended service life, and to a manufacturing method thereof. The wafer carrier comprises a base having a circular shape formed to make a wafer be mounted therein, and a guide means coupled to the edge of the base.</p> |
