| 摘要 |
<p>When a package (product) (5) is formed by cutting a molded substrate (1), the high-quality and highly reliable product (5) is obtained and the productivity of the product (5) is raised. Each package (5)(1c) fastened by a first package fastening mechanism (11) is transferred onto a package mounting surface (upper surface) (12a) of a reverse locking plate (12) and inspected from below by a first inspection mechanism (13) by reversing the reverse locking plate (12) such that the package mounting surface (12a) becomes the lower surface. The first inspected package (5)(1c) held by the reverse locking plate (12) is transferred onto a package mounting surface (14a) of a mounting plate (14). The first inspected package (5)(1c) is inspected from above by a second inspection mechanism (15). The second inspected package (5)(1c) is transferred onto a mounting table (17) at a package mounting position (18a) by a second package fastening mechanism (16).</p> |
