| 发明名称 |
LED MODULE AND METHOD OF BONDING THEREOF |
| 摘要 |
The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board. |
| 申请公布号 |
US2015078014(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201414549596 |
申请日期 |
2014.11.21 |
| 申请人 |
TSMC Solid State Lighting Ltd. |
发明人 |
Yeh Wei-Yu |
| 分类号 |
F21V19/00;B23K20/10;B23K20/00;F21V29/00 |
主分类号 |
F21V19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lighting module, comprising:
a heat sink; a board disposed over the heat sink; a bonding component that bonds the heat sink and the board together, wherein the bonding component contains a combination of a first metal and a second metal; and a photonic lighting device disposed over the board. |
| 地址 |
Hsinchu TW |
