| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a continuity inspection method of a wiring circuit board and a method of manufacturing the wiring circuit board that can detect abnormality of the continuity between electrode pads, even when the electrode pads are electrically interconnected via a plurality of lines.SOLUTION: Measurement probes 54 and 55 are in contact with electrode pads 21 and 31, respectively, and measurement probes 56 and 57 are in contact with the electrode pads 21 and 31, respectively. Current is made to flow to a current path including the electrode pads 21 and 31 and a plurality of lines LA1-LA5 through the measurement probes 54 and 55. The value of the current in the current path is measured, and the voltage value between the measurement probes 56 and 57 is measured. On the basis of the measured current value and the measured voltage value, the continuity between electrode pads 21 and 31 is inspected.</p> |
