ELECTRONIC DEVICE WITH BIMETALLIC INTERFACE ELEMENT FOR WIRE BONDING

摘要

An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

主权项

1. An electronic device, comprising:
at least one chip on which at least one electronic component is integrated, said chip comprising at least one terminal of said at least one electronic component of a material comprising a first metal element, at least one lead of a material comprising a second metal element different from the first metal element, at least one bonding wire of a material comprising a selected one between the first metal element and the second metal element, the bonding wire having opposite ends coupled with the terminal and with the lead, and at least one interface element having a first layer of a material comprising the selected one of the first and second metal elements and a second layer of a material comprising an unselected one of the first and second metal elements, wherein the interface element having said first layer coupled with the bonding wire and said second layer coupled with a component comprising one of the terminal or the lead.