LINKED ARRAYS OF VOID CELLS

摘要

Implementations described and claimed herein include methods of manufacturing related to a spaced array of individually formed void cells, which are linked together. The void cells are protruding, resiliently compressible cells manufactured by thermoforming, extrusion, injection molding, laminating, and/or blow molding processes. The individual void cells are molded and arranged in an array. A separate, porous binding layer is attached to the individual void cells in the array. In one implementation, two arrays may each comprise of linked individually formed void cells, wherein each array is aligned with the other array, and linked individually formed void cells of one array are positioned opposite the linked individually formed void cells of the other array, sharing the same binding layer. In another implementation, multiple arrays can be stacked upon one another. In another implementation, the linked individually formed void cells have substantially different force-deflection characteristics.