发明名称 POROUS MATERIAL, HONEYCOMB STRUCTURE AND HONEYCOMB FILTER
摘要 PROBLEM TO BE SOLVED: To provide a porous material having high thermal shock resistance.SOLUTION: There is provided a porous material in which the content is 6 pts.mass when the content of TiSiCis 50 mass% or less and the total of the content of metal Ti and the content of TiC is 100 pts.mass of the content of TiSiC, where the content of SiC preferably is 1 to 50 mass%, the porosity preferably is 25 to 70%, the average pore diameter preferably is 10 to 40 μm, pores having a pore diameter less than 10 μm is 20% or less of the whole pore and pores having a pore diameter more than 40 μm is 10% or less of the whole pore.
申请公布号 JP2015051898(A) 申请公布日期 2015.03.19
申请号 JP20130185595 申请日期 2013.09.06
申请人 NGK INSULATORS LTD 发明人 KOBAYASHI YOSHIMASA
分类号 C04B38/00;B01D39/20;B01D46/00;C04B35/56;F01N3/022 主分类号 C04B38/00
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