<p>The present invention relates to a printed circuit board capable of minimizing the thickness of the printed circuit board and protecting a circuit pattern by constituting the circuit pattern of the printed circuit board to be embedded in a surface of an insulating layer. The printed circuit board of the present invention comprises: an insulating layer; and first and second external circuit patterns embedded in one surface and the other surface of the insulating layer respectively. The insulating layer additionally includes a groove, and the first and second external circuit patterns are formed in the groove.</p>
申请公布号
KR20150030066(A)
申请公布日期
2015.03.19
申请号
KR20130109281
申请日期
2013.09.11
申请人
LG INNOTEK CO., LTD.
发明人
LEE, SANG MYUNG;YOO, CHANG WOO;NAM, SANG HYUCK;PARK, JAE SEOK