UNDERFILL MATERIAL AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME

摘要

Provided are: an underfill material which enables a wide mounting margin; and a process for producing a semiconductor device using the same. This underfill material (20) comprises an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, and exhibits a lowest-melt-viscosity reaching temperature of 100 to 150ºC and a lowest melt viscosity of 100 to 5000Pa·s as determined under temperature rise conditions of 5 to 50ºC/min. Since the lowest-melt-viscosity reaching temperature of the underfill material varies only slightly as measured under various temperature rise conditions, the underfill material can ensure void-less mounting and good solder jointing even when the temperature profile in thermocompression bonding is not strictly controlled, thus enabling a wide mounting margin.