发明名称 HEATED SUBSTRATE SUPPORT WITH TEMPERATURE PROFILE CONTROL
摘要 Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.
申请公布号 WO2015038610(A1) 申请公布日期 2015.03.19
申请号 WO2014US54945 申请日期 2014.09.10
申请人 APPLIED MATERIALS, INC. 发明人 MERRY, NIR;VOLFOVSKI, LEON
分类号 H01L21/683;H01L21/324 主分类号 H01L21/683
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