| 发明名称 |
Multilayer Ceramic Electronic Component |
| 摘要 |
A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion. |
| 申请公布号 |
US2015077897(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201414549795 |
申请日期 |
2014.11.21 |
| 申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
Wada Hiroyuki;Hirata Yosuke;Hiramatsu Takashi;Saito Yoshito;Tsuji Hideaki;Ukai Hiroyuki |
| 分类号 |
H01G4/258;H01G4/30 |
主分类号 |
H01G4/258 |
| 代理机构 |
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代理人 |
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| 主权项 |
1. A multilayer ceramic electronic component comprising:
an outer layer portion having one or more ceramic layers; a thermal-shock absorbing portion in contact with the outer layer portion and that includes curved ceramic layers and inner electrode layers varying in thickness from point to point in a direction along a principal surface of the outer layer portion; and a normal multilayer portion that includes ceramic layers with less curvature than the curved ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in the direction along the principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion. |
| 地址 |
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