| 发明名称 |
MULTILAYER WIRING BOARD |
| 摘要 |
A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board. |
| 申请公布号 |
US2015075843(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201314389387 |
申请日期 |
2013.03.27 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Yamaguchi Hiroyuki;Kurihara Seiichi;Sakurai Hiroshi;Nukina Shunsuke |
| 分类号 |
H05K1/11;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer wiring board comprising:
a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component; a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired; and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer, wherein a hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board. |
| 地址 |
Tokyo JP |
