POLISHING METHOD AND POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device capable of accurately determining a polishing end point even in a state of an exceedingly thin film.SOLUTION: The polishing method includes: polishing a substrate while measuring the film thickness of the substrate by an optical film thickness measuring instrument; calculating a polishing rate of the substrate during polishing of the substrate; calculating an additional polishing time by dividing a difference between a predetermined detection threshold and a predetermined target film thickness by the polishing rate; and completing polishing of the substrate when the additional polishing time elapses from a time point at which the film thickness reaches the predetermined detection threshold.