| 发明名称 |
Chip Stacking Packaging Structure |
| 摘要 |
A chip stacking packaging structure is provided for achieving high-density stacking and improving a heat dissipation efficiency of the chip stacking packaging structure. The chip stacking packaging structure includes a main substrate and at least one stacking substrate in which a main chip is disposed in the main substrate, at least one stacking chip is disposed on the stacking substrate, and a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip. |
| 申请公布号 |
US2015076686(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201414552674 |
申请日期 |
2014.11.25 |
| 申请人 |
Huawei Technologies Co., Ltd. |
发明人 |
Liu Weifeng |
| 分类号 |
H01L23/34;H01L25/18 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip stacking packaging structure comprising:
a main substrate; and at least one stacking substrate, wherein a main chip is disposed in the main substrate, wherein at least one stacking chip is disposed on the stacking substrate, and wherein a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip. |
| 地址 |
Shenzhen CN |
