发明名称 METHOD AND APPARATUS FOR THERMAL PROCESSING
摘要 PROBLEM TO BE SOLVED: To equalize finish by reducing the change amount of the pressing pressure of a heater tip to workpiece, in cases where the displacement magnitude of the heater tip is large in thermal processing of resin parts, e.g. thermal caulking or soldering, and also stabilize finish.SOLUTION: A thermal processing method comprises holding a heater tip 32 urged downward with a spring 36, vertically movably, with an ascent/descent head 28 which is ascendable and descendable relative to a base 22 and also positionally fixable and causing the ascent/descent head 28 to descend to press the heater tip 32 toward work 48 while causing the heater tip 32 to generate heat, so as to subject the work 48 to thermal processing. During thermal processing of the work 48, the thermal processing is carried out while the ascent/descent head 28 is caused to descend so that the pressing pressure R of the heater tip 32 to the work 48 does not become equal to or lower than a specified pressure.
申请公布号 JP2015051603(A) 申请公布日期 2015.03.19
申请号 JP20130186199 申请日期 2013.09.09
申请人 NIPPON AVIONICS CO LTD 发明人 IWATSUKI TADAHIRO;HIROSE TAKAYUKI;MIYATA TAKASHI
分类号 B29C65/18;B29C65/56 主分类号 B29C65/18
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