POLYURETHANE POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad suitable for planarizing semiconductor, optical, and magnetic substrates.SOLUTION: This polishing pad includes a cast polyurethane polymeric material formed from a prepolymer reaction of a polypropylene glycol and a toluene diisocyanate to form an isocyanate-terminated reaction product. The toluene diisocyanate has less than 5 weight percent aliphatic isocyanate; and the isocyanate-terminated reaction product has 5.55 to 5.85 weight percent unreacted NCO. The isocyanate-terminated reaction product is cured with a 4,4'-methylene-bis(3-chloro-2,6-diethylaniline) curative agent. The non-porous cured product has a tanδ of 0.04 to 0.10, a Young's modulus of 140 to 240 MPa and a Shore D hardness of 44 to 56.