发明名称 |
Light Emitting Device and Light Emitting Device Package |
摘要 |
<p>A light emitting device according to the embodiment of the present invention includes: a light emitting structure which includes a first conductive semiconductor layer, an active layer which is arranged under the first conductive semiconductor layer and a second conductive semiconductor layer which is arranged under the active layer; a first reflection layer which is arranged under the first conductive semiconductor layer; a first protection layer which surrounds the first reflection layer, is arranged under the first conductive semiconductor layer, and has electrical conductivity; a second reflection layer which is arranged under the first protection layer; a sub mount which includes a first metal pad and a second metal pad which are separated in a horizontal direction and are arranged on the upper side thereof; a first bump part which passes through the second reflection layer between the first metal pad and the first protection layer; and a second bump part which is arranged between the second metal pad and the second conductive semiconductor layer.</p> |
申请公布号 |
KR20150029920(A) |
申请公布日期 |
2015.03.19 |
申请号 |
KR20130108964 |
申请日期 |
2013.09.11 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
HONG, EUN JU;OH, JUNG HUN |
分类号 |
H01L33/36;H01L33/44;H01L33/46;H01L33/62 |
主分类号 |
H01L33/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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