| 摘要 |
The present invention relates to a method of manufacturing an integrated circuit device package having flexibility. More particularly, the present invention includes: a step of preparing a first flexible substrate (FCCL) having a first conductive layer on an upper surface, a step of forming a mounting part and a first circuit pattern by partly removing the first conductive layer formed in the upper surface of the first flexible substrate according to a designated circuit, a step of mounting an IC device on the mounting part of the flexible substrate, a step of forming a mold layer to form the first circuit pattern and an IC device on the first flexible substrate, a step of forming multiple through holes in the mold layer by corresponding to the terminal position of the IC device, a step of forming a second conductive layer by performing copper plating on the surface of the mold layer having the through holes and filling the through holes with the copper plating to form vias, a step of partly removing the second conductive layer by corresponding to the vias and forming a terminal pattern, and a step of bonding a solder ball to the terminal pattern by corresponding to the via and completing an IC device package having flexibility. An IC device package which is bent with a constant angle is provided. Cu is used for the electric connection between an IC device and a base substrate, thereby reducing manufacturing costs and minimizing signal loss, and manufacturing a thinner package compared to an existing package. |
