| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of successfully connecting electrode terminals of a semiconductor element and semiconductor element connection pads via solder bumps. <P>SOLUTION: A wiring board 20 comprises: a core substrate 1 having a plurality of through holes 6; a build-up insulation layer 4 deposited on a surface of the core substrate 1; a build-up conductor layer 5 deposited on a top face of the build-up insulation layer 4; a solder resist layer 11 having a plurality of openings 11a exposing a part of the build-up conductor layer 5 as semiconductor element connection pads 9; and solder bumps 12 deposited on the semiconductor connection pads 9. A height H1 of the solder bump 12 deposited on the first semiconductor connection pad 9 located immediately above the through hole 6 is higher than a height H2 of the solder bump 12 deposited on the second semiconductor connection pad 9 not located immediately above the through hole 6. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
