| 摘要 |
A chip component packaging arrangement prevents occurrence of defective loading of chip components during a taping process that is carried out to the package chip components. This arrangement has a small size. A cover tape is prepared having a base tape and a plurality of cover film pieces sequentially attached to the base tape. Each cover film piece has an adhesive part. The cover tape extends in a direction intersecting a longitudinal direction of a carrier tape. The carrier tape has a plurality of component receiving parts sequentially formed in its longitudinal direction. The cover tape is pressed to the carrier tape so that one of the cover film pieces is adhered to the carrier tape to seal the corresponding component receiving part. |
