发明名称 撮像システムおよび撮像システム用の固体撮像装置の製造方法
摘要 Certain embodiments provide an imaging system including a light guiding member supported on a circuit substrate so as to be capable of lighting an object, an optical image-forming member and a solid-state imaging device. The optical image-forming member is arranged on the circuit substrate so as to have an optical axis thereof parallel to the circuit substrate, is arranged on the circuit substrate so as to be able to receive reflected light from the object, emits the reflected light in an oblique direction with respect to a surface of the circuit substrate, and forms an image at a predetermined distance position. The solid-state imaging device includes a light receiving surface that is oblique with respect to the circuit substrate surface, and is mounted on the surface of the circuit substrate so as to have the receiving surface positioned at a position where the image is formed.
申请公布号 JP5687564(B2) 申请公布日期 2015.03.18
申请号 JP20110121833 申请日期 2011.05.31
申请人 株式会社東芝 发明人 関根 弘一
分类号 H04N1/028;H01L27/146 主分类号 H04N1/028
代理机构 代理人
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