| 摘要 |
<p>Provided is a resin composition exhibiting high adhesive strength. The resin composition contains the following components (A) to (E). Component (A) is a (meth)acrylate having a dicyclopentenyl group; component (B) is a (meth)acrylate having a hydroxyl group; component (C) is a (meth)acrylate having a (meth)acryloyl group, and a diene structure or a diene structure added with hydrogen; component (D) is a silane coupling agent; and component (E) is a photopolymerization initiator. Moreover, the resin composition may contain a (meth)acrylic acid as component (F) and a polyvinyl alcohol as component (G).</p> |
