| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a high frequency signal connection structure which maintains the uniformity of bump shapes, improves the shield effect, and reduces the deterioration of transmission characteristics of high frequency signals at the same time. <P>SOLUTION: An insulation coating material 21, which encloses outer peripheries of ground bump mounting pads 14 so as to partially cover ground conductors 15, or the like is provided. Then, a signal bump 33 connects a signal bump mounting pad 12 with a signal bump mounting pad 31, and multiple ground bumps 34 connect the ground bump mounting pads 14 with ground bump mounting pads 32. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
